EMC China Lab

AEC-Q100 IC / Integrated Circuit Compliance Testing

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Update time : 2026-04-25

Relevant authorities including the Ministry of Industry and Information Technology have actively promoted the high-quality development of the automotive electronics industry. In this context, the AEC-Q100 standard formulated by the Automotive Electronics Council (AEC) has become the core reliability certification specification for the application of integrated circuits in the automotive electronics sector.

 

With the accelerated advancement of automotive intelligence and electrification, integrated circuits such as vehicle-mounted MCUs, power ICs and sensor ICs serve as the "brain" and "nerve center" of automotive electronic systems. Their stability under harsh conditions including high temperature, vibration and electromagnetic interference directly determines driving safety and the normal operation of vehicle functions.

 

To mitigate and reduce failure risks caused by integrated circuit malfunctions, the AEC-Q100 standard is continuously updated. The latest version further refines testing requirements for environmental adaptability, electrical stability and mechanical endurance, and adds special test items for high-integration ICs.

 

Since 2024, authorities including the State Administration for Market Regulation have strengthened quality supervision over automotive electronic components, mandating that integrated circuits entering the domestic market must comply with internationally recognized reliability standards such as AEC-Q100.

 

At present, mainstream automobile manufacturers and Tier 1 suppliers regard AEC-Q100 certification as a core procurement prerequisite for integrated circuits. Products without this certification face significant barriers to entry into mainstream automotive supply chains.

 

AEC-Q100 IC / Integrated Circuit Certification & Testing

JJR LAB provides one-stop services covering AEC-Q100 integrated circuit certification testing and technical consultation, helping enterprises meet standard requirements and gain smooth access to the automotive supply chain.

Scope of Applicable Products

The AEC-Q100 standard applies to all integrated circuits deployed in automotive operating environments.

 

Testing Standards

AEC-Q100 certification tests are strictly implemented in accordance with AEC-Q100 Rev-J (the latest official version) released by the Automotive Electronics Council, combined with widely recognized auxiliary standards in the automotive industry. Core reference standards are listed below:

 AEC-Q100 Rev-J: Stress Test Qualification for Integrated Circuits Based on Failure Mechanisms

 AEC-Q100-001: Wire Bond Shear Test

 AEC-Q100-002: HBM electrostatic discharge test

 AEC-Q100-004: Latch-Up

 AEC-Q100-005: Non-Volatile Memory Program/Erase Endurance, Data Retention and Operational Life Test

 AEC-Q100-007: Fault Simulation and Test Grading

 AEC-Q100-008: Early Failure Rate (ELFR)

 AEC-Q100-009: Evaluation of Electrical Distribution

 AEC-Q100-010: Solder Ball Shear Test

 AEC-Q100-011: CDM Electrostatic Discharge Test

 AEC-Q100-012: Short-Circuit Reliability Specification for Sensitive Power Devices in 12V Systems

 

Test Items & Sample Quantity Requirements

AEC-Q100 certification features comprehensive testing to simulate various stress conditions that devices may encounter throughout their service life. It contains 35 test items categorized into 5 major groups. Test items are selected based on device types and packaging forms.

1. TEST GROUP A – Accelerated Environmental Stress Test

No.

Test Item

Abbreviation

Test Method

Sample Requirement

A1

Preconditioning

PC

JEDEC J-STD-020, JESD22-A113

Conducted prior to THB/HAST, AC/UHST, TC and PTC stress application

A2

Biased Temperature Humidity / Biased HAST

THB or HAST

JEDEC JESD22-A101 / A110

77 units, 3 batches

A3

Autoclave / Unbiased HAST / Unbiased Temperature Humidity

AC or UHST or TH

JEDEC JESD22-A102, A118, A101

77 units, 3 batches

A4

Temperature Cycling

TC

JEDEC JESD22-A104 & Appendix 3

77 units, 3 batches

A5

Power Temperature Cycling

PTC

JEDEC JESD22-A105

45 units, 1 batch

A6

High Temperature Storage Life

HTSL

JEDEC JESD22-A103

45 units, 1 batch

 

2. TEST GROUP B – Accelerated Life Simulation Test

No.

Test Item

Abbreviation

Test Method

Sample Requirement

B1

High Temperature Operating Life

HTOL

JESD22-A108

77 units, 3 batches

B2

Early Life Failure Rate

ELFR

AEC-Q100-008

800 units, 3 batches

B3

NVM Endurance, Data Retention & Operating Life

EDR

AEC-Q100-008

77 units, 3 batches

 

3. TEST GROUP C – Package Integrity Test

No.

Test Item

Abbreviation

Test Method

Sample Requirement

C1

Wire Bond Shear

WBS

AEC-Q100-001, AEC-Q003

30 bonds from no less than 5 devices

C2

Wire Bond Pull

WBP

MIL-STD-883 Method 2011, AEC-Q003

30 bonds from no less than 5 devices

C3

Solderability

SD

JEDEC J-STD-002

15 units, 1 batch

C4

Physical Dimensions

PD

JEDEC JESD22-B100 / B108, AEC-Q003

10 units, 3 batches

C5

Solder Ball Shear

SBS

AEC-Q100-010, AEC-Q003

Min. 10 devices, 5 solder balls per device

C6

Lead Integrity

LI

JEDEC JESD22-B105

5 devices, 10 terminals per device

C7

Bump Shear Test

BST

JEDEC JESD22-B117, AEC-Q003 (equivalent)

Min. 5 devices, 20 bumps per device

 

4. TEST GROUP E – Electrical Verification Test

No.

Test Item

Abbreviation

Test Method

Sample Requirement

E1

Function/Parameter Test (Pre & Post Stress)

TEST

Device Specification

All samples

E2

HBM Electrostatic Discharge

HBM

AEC-Q100-002

1 batch

E3

CDM Electrostatic Discharge

CDM

AEC-Q100-011

1 batch

E4

Latch-Up

LU

AEC-Q100-004

11 batches

E5

Electrical Distribution

ED

AEC-Q100-009, AEC-Q003

10 units, 1 batch

E6

Fault Grading

FG

AEC-Q100-007

10 units, 1 batch

E7

Characterization

CHAR

AEC-Q003

10 units, 1 batch

E8

Electromagnetic Compatibility

EMC

SAE J1752/3 – Radiated Emissions

10 units, 1 batch

E9

Short-Circuit Characteristics

SC

AEC-Q100-012

10 units, 1 batch

E10

Soft Error Rate

SER

JEDEC JESD89-1 / JESD89-2 & JESD89-3

10 units, 1 batch

E11

Lead-Free Compliance

LF

AEC-Q005

10 units, 1 batch

 

5. TEST GROUP G – Cavity Package Integrity Test

No.

Test Item

Abbreviation

Test Method

Sample Requirement

G1

Mechanical Shock

MS

JEDEC JESD22-B110

15 units, 1 batch

G2

Variable Frequency Vibration

VFV

JEDEC JESD22-B103

15 units, 1 batch

G3

Constant Acceleration

CA

MIL-STD-883 Method 2001

15 units, 1 batch

G4

Gross & Fine Leak

GFL

MIL-STD-883 Method 1014

15 units, 1 batch

G5

Package Drop Test

DROP

/

5 units, 1 batch

G6

Lid Torque

LT

MIL-STD-883 Method 2024

4 units, 1 batch

G7

Die Shear Strength

DS

MIL-STD-883 Method 2019

5 units, 1 batch

G8

Internal Water Vapor Content

IWV

MIL-STD-883 Method 1018

5 units, 1 batch

Testing Cycle

The overall cycle of AEC-Q100 full-item certification is comprehensively determined by test complexity, sample quantity and laboratory scheduling. The standard full testing period is 3 to 4 months.


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