Relevant authorities including the Ministry of Industry and Information Technology have actively promoted the high-quality development of the automotive electronics industry. In this context, the AEC-Q100 standard formulated by the Automotive Electronics Council (AEC) has become the core reliability certification specification for the application of integrated circuits in the automotive electronics sector.
With the accelerated advancement of automotive intelligence and electrification, integrated circuits such as vehicle-mounted MCUs, power ICs and sensor ICs serve as the "brain" and "nerve center" of automotive electronic systems. Their stability under harsh conditions including high temperature, vibration and electromagnetic interference directly determines driving safety and the normal operation of vehicle functions.
To mitigate and reduce failure risks caused by integrated circuit malfunctions, the AEC-Q100 standard is continuously updated. The latest version further refines testing requirements for environmental adaptability, electrical stability and mechanical endurance, and adds special test items for high-integration ICs.
Since 2024, authorities including the State Administration for Market Regulation have strengthened quality supervision over automotive electronic components, mandating that integrated circuits entering the domestic market must comply with internationally recognized reliability standards such as AEC-Q100.
At present, mainstream automobile manufacturers and Tier 1 suppliers regard AEC-Q100 certification as a core procurement prerequisite for integrated circuits. Products without this certification face significant barriers to entry into mainstream automotive supply chains.
JJR LAB provides one-stop services covering AEC-Q100 integrated circuit certification testing and technical consultation, helping enterprises meet standard requirements and gain smooth access to the automotive supply chain.
The AEC-Q100 standard applies to all integrated circuits deployed in automotive operating environments.
AEC-Q100 certification tests are strictly implemented in accordance with AEC-Q100 Rev-J (the latest official version) released by the Automotive Electronics Council, combined with widely recognized auxiliary standards in the automotive industry. Core reference standards are listed below:
• AEC-Q100 Rev-J: Stress Test Qualification for Integrated Circuits Based on Failure Mechanisms
• AEC-Q100-001: Wire Bond Shear Test
• AEC-Q100-002: HBM electrostatic discharge test
• AEC-Q100-004: Latch-Up
• AEC-Q100-005: Non-Volatile Memory Program/Erase Endurance, Data Retention and Operational Life Test
• AEC-Q100-007: Fault Simulation and Test Grading
• AEC-Q100-008: Early Failure Rate (ELFR)
• AEC-Q100-009: Evaluation of Electrical Distribution
• AEC-Q100-010: Solder Ball Shear Test
• AEC-Q100-011: CDM Electrostatic Discharge Test
• AEC-Q100-012: Short-Circuit Reliability Specification for Sensitive Power Devices in 12V Systems
AEC-Q100 certification features comprehensive testing to simulate various stress conditions that devices may encounter throughout their service life. It contains 35 test items categorized into 5 major groups. Test items are selected based on device types and packaging forms.
No. | Test Item | Abbreviation | Test Method | Sample Requirement |
A1 | Preconditioning | PC | JEDEC J-STD-020, JESD22-A113 | Conducted prior to THB/HAST, AC/UHST, TC and PTC stress application |
A2 | Biased Temperature Humidity / Biased HAST | THB or HAST | JEDEC JESD22-A101 / A110 | 77 units, 3 batches |
A3 | Autoclave / Unbiased HAST / Unbiased Temperature Humidity | AC or UHST or TH | JEDEC JESD22-A102, A118, A101 | 77 units, 3 batches |
A4 | Temperature Cycling | TC | JEDEC JESD22-A104 & Appendix 3 | 77 units, 3 batches |
A5 | Power Temperature Cycling | PTC | JEDEC JESD22-A105 | 45 units, 1 batch |
A6 | High Temperature Storage Life | HTSL | JEDEC JESD22-A103 | 45 units, 1 batch |
No. | Test Item | Abbreviation | Test Method | Sample Requirement |
B1 | High Temperature Operating Life | HTOL | JESD22-A108 | 77 units, 3 batches |
B2 | Early Life Failure Rate | ELFR | AEC-Q100-008 | 800 units, 3 batches |
B3 | NVM Endurance, Data Retention & Operating Life | EDR | AEC-Q100-008 | 77 units, 3 batches |
No. | Test Item | Abbreviation | Test Method | Sample Requirement |
C1 | Wire Bond Shear | WBS | AEC-Q100-001, AEC-Q003 | 30 bonds from no less than 5 devices |
C2 | Wire Bond Pull | WBP | MIL-STD-883 Method 2011, AEC-Q003 | 30 bonds from no less than 5 devices |
C3 | Solderability | SD | JEDEC J-STD-002 | 15 units, 1 batch |
C4 | Physical Dimensions | PD | JEDEC JESD22-B100 / B108, AEC-Q003 | 10 units, 3 batches |
C5 | Solder Ball Shear | SBS | AEC-Q100-010, AEC-Q003 | Min. 10 devices, 5 solder balls per device |
C6 | Lead Integrity | LI | JEDEC JESD22-B105 | 5 devices, 10 terminals per device |
C7 | Bump Shear Test | BST | JEDEC JESD22-B117, AEC-Q003 (equivalent) | Min. 5 devices, 20 bumps per device |
No. | Test Item | Abbreviation | Test Method | Sample Requirement |
E1 | Function/Parameter Test (Pre & Post Stress) | TEST | Device Specification | All samples |
E2 | HBM Electrostatic Discharge | HBM | AEC-Q100-002 | 1 batch |
E3 | CDM Electrostatic Discharge | CDM | AEC-Q100-011 | 1 batch |
E4 | Latch-Up | LU | AEC-Q100-004 | 11 batches |
E5 | Electrical Distribution | ED | AEC-Q100-009, AEC-Q003 | 10 units, 1 batch |
E6 | Fault Grading | FG | AEC-Q100-007 | 10 units, 1 batch |
E7 | Characterization | CHAR | AEC-Q003 | 10 units, 1 batch |
E8 | Electromagnetic Compatibility | EMC | SAE J1752/3 – Radiated Emissions | 10 units, 1 batch |
E9 | Short-Circuit Characteristics | SC | AEC-Q100-012 | 10 units, 1 batch |
E10 | Soft Error Rate | SER | JEDEC JESD89-1 / JESD89-2 & JESD89-3 | 10 units, 1 batch |
E11 | Lead-Free Compliance | LF | AEC-Q005 | 10 units, 1 batch |
No. | Test Item | Abbreviation | Test Method | Sample Requirement |
G1 | Mechanical Shock | MS | JEDEC JESD22-B110 | 15 units, 1 batch |
G2 | Variable Frequency Vibration | VFV | JEDEC JESD22-B103 | 15 units, 1 batch |
G3 | Constant Acceleration | CA | MIL-STD-883 Method 2001 | 15 units, 1 batch |
G4 | Gross & Fine Leak | GFL | MIL-STD-883 Method 1014 | 15 units, 1 batch |
G5 | Package Drop Test | DROP | / | 5 units, 1 batch |
G6 | Lid Torque | LT | MIL-STD-883 Method 2024 | 4 units, 1 batch |
G7 | Die Shear Strength | DS | MIL-STD-883 Method 2019 | 5 units, 1 batch |
G8 | Internal Water Vapor Content | IWV | MIL-STD-883 Method 1018 | 5 units, 1 batch |
The overall cycle of AEC-Q100 full-item certification is comprehensively determined by test complexity, sample quantity and laboratory scheduling. The standard full testing period is 3 to 4 months.
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