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Temperature Shock Test (IEC 60068-2-14:2009)

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Update time : 2025-12-21

Temperature shock test is a reliability testing method that simulates extreme environmental conditions through rapid temperature changes. It is mainly used to evaluate the resistance of materials or products under severe temperature fluctuations.

 

Samples are alternately exposed to high-temperature (e.g., 150℃) and low-temperature (e.g., -40℃) environments with an extremely short temperature transition time (usually ≤ 5 minutes, even as low as 10 seconds). This simulates the impact of instantaneous temperature changes, and primarily verifies physical or chemical damages to products caused by thermal expansion and contraction, such as material cracking, solder joint fracture, and poor contact of components.

 

Temperature shock test chambers, the equipment for this test, can be divided into two-chamber shock chambers and three-chamber shock chambers. Their operating modes are high temperature → low temperature → high temperature and high temperature → normal temperature → low temperature → normal temperature → high temperature respectively.

 

Temperature Shock Test (IEC 60068-2-14:2009)(图1)


Key Parameters

1. Temperature Range: -70℃~+150℃ (common range); extendable to liquid nitrogen cooling (-196℃) for specific scenarios.

2. Transition Rate: ≥ 10℃/min (air shock method); ≥ 25℃/min (liquid shock method).

3. Cycle Times: Usually ≥ 10 cycles; up to hundreds of cycles for special requirements.

4. Recovery Time: ≤ 5 minutes (full cycle switching between -65℃ and +150℃).

 

Differences from Rapid Temperature Change Test

Item

Temperature Shock Test

Rapid Temperature Change Test

Temperature Change Mode

Instant switching between high/low temperature chambers (e.g., high-temperature tank → low-temperature tank)

Continuous linear heating/cooling (no physical transfer)

Stress Concentration Areas

Material joints, solder joints, etc. (higher thermal stress)

Uniform thermal/cold stress on all materials

Applicable Scenarios

Severe instantaneous temperature changes (e.g., spacecraft entering/exiting the atmosphere)

Slow temperature changes (e.g., seasonal temperature differences)

 

Reference Standards

1. Environmental testing – Part 2: Tests – Test Na: Temperature change (IEC 60068-2-14:2009)

2. Environmental testing – Part 2: Test methods – Test N: Temperature change (Clause 7, Test Na of GB/T 2423.22-2012)

 

About China JJR Laboratory

China JJR Laboratory is a high-tech testing lab established to meet the testing needs in the production process of high-tech electronic products. A substantial investment has been made to equip the laboratory with a full range of imported equipment, ensuring more stable and accurate testing data.


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